This Company Launches Its First Semiconductor Unit, Will Manufacture 3D Chips in India

India’s leading defense company, Paras Defence & Space Technologies, has taken a historic step. The company has entered the semiconductor sector by launching a new subsidiary – Paras Semiconductor Private Ltd.

This is considered the first such initiative in India’s defense sector, specifically focusing on advanced 3D and heterogeneous packaging.

In addition, the company will establish a state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility, where semiconductor units will be assembled and packaged using highly advanced techniques.

How will this plant be used?

• Optical and optronic systems used for defense and security (such as night vision, laser sensors, binoculars)
• High-performance computing (HPC)
• Networking and large data centers

Reduced dependence on other countries

This company will utilize advanced technologies such as chiplet integration and advanced system-in-package. This will reduce India’s dependence on foreign chips in sensitive areas like defense.

Strengthening Defense Electronics

Regarding the Semiconductor Unit, Managing Director Munjal Sharad Shah stated, “Semiconductors have become crucial for the country’s security today.

Advanced packaging makes chips more reliable, faster, and gives us complete control over the supply chain. With Paras Semiconductor, we will further strengthen our existing capabilities in defense electronics and contribute to building a robust semiconductor ecosystem for a self-reliant India.”